Summary
Overview
Work History
Education
Skills
Websites
Accomplishments
Leisure
Toolsandsoftware
Personal Information
Languages
Timeline
Generic
Yezouma Dieudonné ZONOU

Yezouma Dieudonné ZONOU

Echirolles

Summary

With over 9 years of cumulative experience at STMicroelectronics, CEA-Leti, and Itancia, I have honed my skills in microelectronic back-end design, manufacturing, and assembly processes. My expertise includes electronic devices and thin films characterization. I hold a master's degree in the physics of semiconductor materials and micro/nano devices conception and manufacturing processes.

Overview

10
10
years of professional experience

Work History

Package Development Engineer

STMicroelectronics
Grenoble
07.2021 - Current
  • Driving internal plant and OSAT NPI assembly teams
  • Driving new package RFQ and feasibility studies
  • Conducting Technical Gap Analysis and Front/Back-End Compatibility Risk Assessments
  • Designing Package Outlines and Mount Bonding Diagrams
  • Managing BOM Selection and Manufacturing Plant Selection
  • Controlling Assembly Workability Process
  • Leading Package Mass Production Line Stress Tests
  • Managing a portfolio of packages including QFN/DFN, TSSOP, WLCSP, SOT, LGA

Development and Production Support Engineer

Itancia
Grenoble
06.2019 - 07.2021
  • Developed Assembly Processes by Thermal Bonding Films
  • Developed Soldering Processes for BGA, QFN, CSP
  • Conducted Feasibility Studies for Assembly Projects
  • Managed Capacitive Sensors Manufacturing Line
  • Maintained Production Machine Park
  • Ensured X-Radiation Safety (PCR)
  • Performed Quality Audits
  • Acted as Backup Manager for the Production Team

Self-Employed

Kooltechstore
Grenoble
01.2018 - 03.2019
  • Communicated with Suppliers for Connected Watches Assembly
  • Managed Digital Marketing and Web Design
  • Handled Stock Management and After-Sales Service

Flip-Chip Process and Assembly R&D Engineer

CEA-LETI
Grenoble
01.2015 - 01.2018
  • Developed Flip-Chip Assembly Processes (Thermocompression and Mass Reflow)
  • Conducted Chemical Surface Treatments and Wetting Studies
  • Designed Layouts and Back-End of Line Process Flows
  • Managed Batch Processing and Alignment Measurement Development
  • Characterized Optical Coupling and Electrical/Mechanical Properties
  • Maintained Assembly and Characterization Machines

Master Degree Internship

LAAS-CNRS
Toulouse
04.2014 - 09.2014
  • Designed and Characterized OLEDs in ITO and AZO
  • Conducted Photolithography Processes and Organic Material Deposition
  • Performed Thin Films Characterization

Education

Master's Degree - Embedded Systems and Telecommunications, Micro and Nanotechnologies

Université Paul Sabatier
Toulouse
09.2014

Skills

  • Multi-Project Management
  • BE NPI Development Process
  • Technical Gap Analysis
  • RFQ
  • Feasibility Study
  • DOE
  • FMEA
  • 8D Plan
  • Collaboration with OSAT
  • Cross-Project Problem Solving
  • Lead of Assembly Process
  • Package Mounting and Bonding Diagram Design
  • Back-End-of-Line Design
  • Manufacturing Process
  • Flip-Chip Assembly Expertise
  • Wire-Bonding
  • Solder Bonding
  • Copper Pillar Bonding
  • Mass Reflow
  • Thermocompression
  • Thermal Soldering
  • Ultrasonic Soldering
  • Solder Wetting Optimization
  • Physics of Semiconductor Materials
  • Optical Coupling
  • Characterization of Thin Films
  • Electronic Circuits Design
  • Manufacturing

Accomplishments

  • O. Castany, Y. D. Zonou - Procédé d'assemblage de connecteurs électriques (REF: DD17773VL)
  • Self-Alignment with Copper Pillars Micro-Bumps for Positioning Optical Devices at Submicronic Accuracy (ECTC 2017)
  • Towards Self-Alignment with Copper Pillars (ESTC 2016)
  • Self-Align and Self-Assembly at the Nanometer and Millimeter Scale—Modeling and Cases of Use (MRS Fall Meeting 2017)

Leisure

  • Snowboarding
  • Mountain Hiking
  • Music and Dance

Toolsandsoftware

FC150, FC300 Bonding Machine, Nordson Dage Shear and Pull Test Machines, XPS, AES, TOF-SIMS, SEM-EDX, FIB, Ellipsometer, Diffractometer X, Optical and Electrical Probers, Mechanical and Optical Profilometer, Ionic and Mechanical Polishing, Autocad, SPICE, Cadence, LABVIEW, CLEWIN, KLAYOUT, SILVACO, COMSOL, ALDO, MATLAB, PROTEUS, Micro Wind, ALTIUM Designer, Surface Evolver, SolidWorks

Personal Information

Date of Birth: 07/29/88

Languages

  • French
  • English

Timeline

Package Development Engineer

STMicroelectronics
07.2021 - Current

Development and Production Support Engineer

Itancia
06.2019 - 07.2021

Self-Employed

Kooltechstore
01.2018 - 03.2019

Flip-Chip Process and Assembly R&D Engineer

CEA-LETI
01.2015 - 01.2018

Master Degree Internship

LAAS-CNRS
04.2014 - 09.2014

Master's Degree - Embedded Systems and Telecommunications, Micro and Nanotechnologies

Université Paul Sabatier
Yezouma Dieudonné ZONOU